The paper discusses how to control the EMI in designing twolayer PCB at three points:part placement, routing and copper pour.
从零件放置、布线和补铜箔等三个方面讨论了在双面印制板设计中如何控制电磁干扰。
PCB design mostly includes the system's size programming, board layer programming and routing design.
印刷电路板设计主要包括了系统尺寸规划、板层规划和布线设计等等。
Routing, PCB production, layout and weld-4 steps of making a circuit are presented in turn, followed by adjusting and trim.
按照电路pcb布线-制板-元件配置-焊接的顺序,依次介绍各个步骤,并对完成的电路进行综合调试。
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